AETEC company logoAETEC PTE LTDAutomation and roboticsENGINEERING REVIEW Rev OProject film
Prepared by AETEC Pte Ltdwww.aetec.netIn partnership with ABBCustomer: Micron
Loading geometry
TEST DETAIL
Bending Torsion ESD contact Sensor / air
Y ↑ Operator side +ZDimensions in mm

CURRENT ACTION

Ready at home

Select a recipe and run the handling sequence.

00:00illustrative process time

Bending raised 150 mm · lower torsion · verified head height before platen travel. Actual GoFa 5 CAD · nominal motion preview; readings are synthetic.

ENGINEERING BASIS

Micron automated test cell

ARTIFICIAL INSTRON CHANNELS

Live specimen

Signed force: downward +, upward −. Displacement is head travel from the load position; take-up is excluded from corrected specimen deflection. No hardware connection.

Calculation assumptions and real Instron integration